Browsing by Author "Yesilyurt, Cemal"

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    Effect of Cyclic Loading and an Intermediate Material on Microtensile Bond Strengths of a Dual-Cure Resin Cement To Dentin Resin-Coated With All-In Adhesives
    (Elsevier Taiwan, 2012) Belli, Sema; Ozcopur, Betul; Yesilyurt, Cemal; Akman, Melek; Breslin, Nicholas; Dorsman, Greg
    Background/purpose: The purpose of this in vitro study was to evaluate the effects of mechanical loading and an intermediate material on microtensile bond-strengths (mu TBSs) of four all-in-one adhesives and a total-etching adhesive system to dentin. Materials and methods: Dentin surfaces of sound human third molars were exposed and treated with Danville Experimental (Danville Materials), G Bond (GC), Clearfil S-3 Bond (Kuraray), AdheSE One (Vivadent), and Prelude total-etch (Danville Materials). Dual-curable resin (Multicore; Vivadent) build-ups were created with and without the use of Prelude Dual/Self Cure Link (Danville Materials). Two subgroups were created (with and without mechanical-loading: 5 x 10(4)[cycles]; 50 N at 0.2 Hz). After storage at 37 degrees C for 1 week, the mu TBS test was performed. Data were calculated (MPa) and statistically analyzed (multivariate analysis of variance and Scheffe's tests). Results: Pre-test failure was observed, and no data were obtained from groups in the absence of Prelude Dual/Self Cure Link, except for the Prelude total-etch group. Prelude total-etch provided significantly higher mu TBSs to dentin than did the other adhesives (P < 0.05). Bond strengths of all tested adhesives were significantly reduced upon application of the loading regimen (P < 0.05). Clearfil S-3 Bond and G Bond provided significantly higher mu TBSs to dentin than AdheSE One and the experimental adhesive (P < 0.05). Conclusion: Mechanical loading significantly decreased the adhesive performance, and Prelude Dual/Self Cure Link increased it for all-in-one adhesives when used with a dual-curable resin. Copyright (c) 2012, Association for Dental Sciences of the Republic of China. Published by Elsevier Taiwan LLC. All rights reserved.