Comparison of Electrical Properties of Cuo/N-si Contacts With Cu/N-si

dc.authorid Ozmentes, Resit/0000-0002-5893-0660
dc.authorscopusid 57205748601
dc.authorscopusid 6602421311
dc.authorwosid Özmenteş, Reşit/Aad-3391-2019
dc.contributor.author Ozmentes, Resit
dc.contributor.author Temirci, Cabir
dc.date.accessioned 2025-05-10T17:09:29Z
dc.date.available 2025-05-10T17:09:29Z
dc.date.issued 2020
dc.department T.C. Van Yüzüncü Yıl Üniversitesi en_US
dc.department-temp [Ozmentes, Resit] Van YuzuncuYil Univ, Inst Sci, Van, Turkey; [Temirci, Cabir] Van YuzuncuYil Univ, Fac Sci, Dept Phys, Van, Turkey en_US
dc.description Ozmentes, Resit/0000-0002-5893-0660 en_US
dc.description.abstract In this study, CuO/n-Si/A1 heterojunction contacts were fabricated by thermal evaporation technique. Electrical characteristics of the samples were investigated with the current-voltage (I-V), capacitance-voltage/frequency (C-V/f), and conductance voltage (G/V) measurements at room temperature. Also, Cu/n-Si/Al Schottky contact was produced as a reference sample to investigate the electrical properties of the samples. The values of ideality factor (n), barrier height (Phi(b)) and series resistance (R-s) of the samples were calculated from the forward bias current-voltage (I-V) and reverse bias capacitance-voltage (C-V) characteristics. Also, for checking the consistency of the results, Cheung and Norde functions were used. The experimental result values of CuO/n-Si contact were compared with the values of the reference Cu/n-Si Schottky diode. It was observed that the values of the ideality factor and barrier height of the CuO/n-Si heterojunction were higher than those of the Cu/n-Si Schottky contact, while the series resistance was lower. Also, it has been observed that the value of capacitance decreased with increasing frequency and after a certain value of frequency it was almost constant. The ideality factor of CuO/n-Si/Al heterostructure is about 2.40 and so, it is not close to the ideal behavior. en_US
dc.description.sponsorship Scientific Research Management Office (BAPB); Van Yuzuncu Yil University, Turkey [2015-FBED066] en_US
dc.description.sponsorship This study was supported by Scientific Research Management Office (BAPB), Van Yuzuncu Yil University, Turkey, under grant No. 2015-FBED066. en_US
dc.description.woscitationindex Science Citation Index Expanded
dc.identifier.doi 10.2478/msp-2020-0051
dc.identifier.endpage 483 en_US
dc.identifier.issn 2083-134X
dc.identifier.issue 3 en_US
dc.identifier.scopus 2-s2.0-85096996214
dc.identifier.scopusquality Q3
dc.identifier.startpage 475 en_US
dc.identifier.uri https://doi.org/10.2478/msp-2020-0051
dc.identifier.uri https://hdl.handle.net/20.500.14720/7143
dc.identifier.volume 38 en_US
dc.identifier.wos WOS:000600545900015
dc.identifier.wosquality Q4
dc.language.iso en en_US
dc.publisher Sciendo en_US
dc.relation.publicationcategory Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı en_US
dc.rights info:eu-repo/semantics/openAccess en_US
dc.subject Cuo en_US
dc.subject Heterojunction en_US
dc.subject Thermal Evaporation en_US
dc.subject Electrical Properties en_US
dc.title Comparison of Electrical Properties of Cuo/N-si Contacts With Cu/N-si en_US
dc.type Article en_US
dspace.entity.type Publication

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