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Comparison of Electrical Properties of Cuo/N-si Contacts With Cu/N-si

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Date

2020

Journal Title

Journal ISSN

Volume Title

Publisher

Sciendo

Abstract

In this study, CuO/n-Si/A1 heterojunction contacts were fabricated by thermal evaporation technique. Electrical characteristics of the samples were investigated with the current-voltage (I-V), capacitance-voltage/frequency (C-V/f), and conductance voltage (G/V) measurements at room temperature. Also, Cu/n-Si/Al Schottky contact was produced as a reference sample to investigate the electrical properties of the samples. The values of ideality factor (n), barrier height (Phi(b)) and series resistance (R-s) of the samples were calculated from the forward bias current-voltage (I-V) and reverse bias capacitance-voltage (C-V) characteristics. Also, for checking the consistency of the results, Cheung and Norde functions were used. The experimental result values of CuO/n-Si contact were compared with the values of the reference Cu/n-Si Schottky diode. It was observed that the values of the ideality factor and barrier height of the CuO/n-Si heterojunction were higher than those of the Cu/n-Si Schottky contact, while the series resistance was lower. Also, it has been observed that the value of capacitance decreased with increasing frequency and after a certain value of frequency it was almost constant. The ideality factor of CuO/n-Si/Al heterostructure is about 2.40 and so, it is not close to the ideal behavior.

Description

Ozmentes, Resit/0000-0002-5893-0660

Keywords

Cuo, Heterojunction, Thermal Evaporation, Electrical Properties

Turkish CoHE Thesis Center URL

WoS Q

Q4

Scopus Q

Q3

Source

Volume

38

Issue

3

Start Page

475

End Page

483